FLYING PROBE MACHINE

FLYING PROBE MACHINE

In order to guarantee the maximum reliability of the electronic boards, Micro Systems uses an automatic flying probe test: the SPEA Flying Probe Tester 4020

Flying Probe Machine micro systems collaudo schede elettroniche
The SPEA flying probe test 4020 improves the testing procedures at Micro Systems thanks to the in-circuit tests on all components in order to identify and eliminate all defects that are present.

The Flying probe makes it possible to contact the smallest soldering pads of pins for 01005, 0201, as well as circuit components integrated with RQFP packages. Such a high level of accuracy is made possible by the linear optical encoders located directly on the X, Y and Z axes, which make it possible to dynamically measure the actual position of the flying probes. With a resolution of 0.012 µm, they guarantee a pointing precision and constancy over time that is infinitely superior to systems based on rotary encoders or a planar motor.

The Flying probe measures the nodal impedance of all the nets on the board: it checks that each individual net performs as expected. The ability to discriminate very small measurements (in the order of 0.1 pF) makes this technique accurate and exhaustive: it performs not only capacitive measurements but also impedance and junction, making it useful not only for short, fast tests, but also for enormously speeding up the performance of in-circuit tests.It is also possible to detect defects in sections of the board that cannot be directly contacted by testing all the board components: active, discrete and passive.
In addition to guaranteeing maximum coverage of process defects such as soldering short circuits or short circuits on printed circuits, it makes it possible to detect the defects that are hard to identify by performing in-circuit, parametric or functional tests. Defects on the input/output stages of integrated circuits, lateral parasitic impedance, current dispersion on printed circuits cannot in fact be detected using traditional testing devices and methods.

SPECIFICATIONS

^

Maximum reliability thanks to the chance to simultaneously combine different testing techniques

^

Probes for Micro SMD (008004) with high precision linear optical encoders on the XYZ axes

^

Extremely high calculation precision

^

Total coverage of the most critical components

^

Automatic LED colour and intensity tests

^

3D test for identifying tombstone and mechanical defects

^

NZT 3.0 system for full coverage of short circuits

^

Parallel programming of more than 4 boards at the same time, even different

MICRO SYSTEMS S.r.l. - Via Bologna 25 - 41016, Novi di Modena - MO - Telefono: (+39)059.67.71.59 - E-mail : microsys@micro-systems.it - C.F. e P.IVA 01306460369

Copyright © 2016 MICRO-SYSTEMS S.R.L. ®